Hybrid Silicon Photonic Integrated Circuit Technology
نویسندگان
چکیده
منابع مشابه
Optimization of the Hybrid Silicon Photonic Integrated Circuit Platform
In the hybrid silicon platform, active III/V based components are integrated on a silicon-on-insulator photonic integrated circuit by means of wafer bonding. This is done in a self-aligned back-end process at low temperatures, making it compatible with CMOS-based silicon processing. This approach allows for low cost, high volume, high quality and reproducible chip fabrication. Such features mak...
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Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the labo...
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ژورنال
عنوان ژورنال: IEEE Journal of Selected Topics in Quantum Electronics
سال: 2013
ISSN: 1077-260X,1558-4542
DOI: 10.1109/jstqe.2012.2235413